ATxmega64A3U-MHR Microchip Technology IC MCU 8BIT 64KB FLASH 64QFN

label:
2024/01/18 109



• High-performance, low-power Atmel® AVR® XMEGA® 8/16-bit Microcontroller
• Nonvolatile program and data memories ̶ 64K - 256KBytes of in-system self-programmable flash ̶ 4K - 8KBytes boot section ̶ 2K - 4KBytes EEPROM ̶ 4K - 16KBytes internal SRAM
• Special microcontroller features ̶ Power-on reset and programmable brown-out detection ̶ Internal and external clock options with PLL and prescaler ̶ Programmable multilevel interrupt controller ̶ Five sleep modes


CATALOG
ATxmega64A3U-MHR COUNTRY OF ORIGIN
ATxmega64A3U-MHR PARAMETRIC INFO
ATxmega64A3U-MHR PACKAGE INFO
ATxmega64A3U-MHR MANUFACTURING INFO
ATxmega64A3U-MHR PACKAGING INFO
ATxmega64A3U-MHR ECAD MODELS


COUNTRY OF ORIGIN
Thailand
Taiwan (Province of China)


PARAMETRIC INFO
Data Bus Width (bit) 8|16
Family Name XMEGA
Device Core AVR
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 32
Program Memory Type Flash
Program Memory Size 64KB
RAM Size 4KB
Maximum Expanded Memory Size 16MB
Maximum CPU Frequency (MHz) 32
DMA Channels 4
Number of Programmable I/Os 50
Number of Timers 7
ADC Channels 8/8
DAC Channels 2
ADC Resolution (bit) 12/12
Number of ADCs Dual
Core Architecture AVR
Number of DACs Single
DAC Resolution (bit) 12
Watchdog 1
Analog Comparators 4
Interface Type SPI/TWI/USART/USB
Programmability Yes
SPI 3
I2C 0
I2S 0
UART 0
USART 7
CAN 0
USB 1
Ethernet 0
Minimum Operating Supply Voltage (V) 1.6
Typical Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package VQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 64
Lead Shape No Lead
PCB 64
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 9
Package Width (mm) 9
Package Height (mm) 0.88
Package Diameter (mm) N/R
Package Overall Length (mm) 9
Package Overall Width (mm) 9
Package Overall Height (mm) 0.9
Seated Plane Height (mm) 0.9
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Jedec N/A


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel


ECAD MODELS


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